The role of Joule heating in the formation of nanogaps by electromigration

Characterization of nanoscale temperature fields during electromigration of nanowires

Quantitative studies of nanoscale heat dissipation (Joule heating) are essential for advancing nano-science and technology. Joule heating is widely expected to play a critical role in accelerating electromigration induced device failure. However, limitations in quantitatively probing temperature fields—with nanoscale resolution—have hindered elucidation of the role of Joule heating in electromi...

Effect of Joule-Heating Annealing on Giant Magnetoimpedance of Co64Fe4Ni2B19-xSi8Cr3Alx (x = 0, 1 and 2) Melt-Spun Ribbons

In this work, we have studied the influence of dc joule-heating thermal processing on the structure, magnetoimpedance (MI) and thermal properties of Co64Fe4Ni2B19-xSi8Cr3Alx (x = 0, 1, and 2) rapidly solidified melt-spun ribbons. The nanocrystallization process was carried out by the current annealing of as-spun samples at various current densities. As-spun and joule-heated samples were studied...

Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

Articles you may be interested in Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure Appl. Investigation of void nucleation and propagation during electromigration of flip-chip solder jo...

Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints

Electrical Methods for Mechanical Characterization of Interconnect Thin Films

We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in the materials system due to differences in thermal expansion between the metal and constraining substrate and passivation. Our efforts concentrate o...